AMD Embedded Roadmap 2022-2016 Leaked

The 2022-2016 roadmap for AMD's Embedded solutions has been leaked. The AMD Embedded Solutions business unit relies virtually entirely on products designed for AMD'due south "Client" segment. And so you can remainder assured that any product making its fashion towards the embedded market place will make its manner to store shelves for ordinary consumers first.

AMD Embedded Roadmap 2022-2016 Leaked - 20nm APUs and SOCs Revealed

The visitor is planning to introduce two new x86 APU families and one new ARM APU family in 2022. The leak includes new insight into AMD'southward side by side generation high-functioning and depression power APUs. It also gives us a timeline for AMD's next generation graphics. The lineup is stacked into v tiers, the top tier R-Serial are the high operation scalable CPUs which will supervene upon the Opteron 6300 and 4300 Serial embedded processors. The series is denoted past AMD R-Series "A" while the AMD R-Series "X" family is the x86 APUs and SOCs stack. At that place are four R-Series APUs/SOCs which include Eternity, Bald Eagle, Merlin Falcon and Heirofalcon which are detailed below:

AMD R-Series "Etrinity" APU

The AMD R-Series Etrinity APU is based off the x86 Piledriver core architecture featuring up to four cores. The Eternity APU delivers up to 2 times the comeback over AMD Phenom II processor series and accept enhanced DirectX eleven graphics support forth with Hard disk drive Decode H.264, VC-i, MPEG-two, DivX, HW Encode @ 1080P/lx FPS, Discrete graphics support and IOMMU with address translation features. The Eternity APU also include faster memory support of DDR3-1600 MHz DIMMs rated at i.5/ane.35/1.25V. Display technologies include support for Eyefinity and Display port i.2 capability. Since we are talking virtually a scalable flake architecture, the Eternity APU will exist bachelor in both uBGA and uPGA packages ranging from TDPs of 17W to 35W. The scrap will be compatible with AMD A70M/A74/A77E PCH. AMD R-Series Eternity APU

AMD R-Series "Bald Eagle" APU

On the high-performance side, AMD has the Baldheaded Eagle APU/CPU featuring the x86 Steamroller cores. The Embedded chips would be bachelor in Dual and Quad core variants with the APU models featuring an GCN enabled GPU with a TDP of 17 to 35 W. Both the APU and CPU models would feature full support for HSA enhancements delivering superior and next generation performance for embedded clients. The x86 cores will deliver 10-15% performance increment over Etrinity cores and feature 4 MB of shared L2 cache. The new graphics core will also deliver 15-30% operation increase over the eTrinity APU and feature support for DirectX xi.1 and HSA.

The Radeon fleck integrated on Bald Eagle would exist based on the GCN core compages and its a surprise that dissimilar the discrete desktop Volcanic Islands lineup which would possibly use a new naming scheme, the iGPs stick to the older branding scheme. The Baldheaded Eagle APU/CPU would replace the current R-Series APU/CPU which characteristic the x86 Piledriver cores. I/O features will include PCI-due east Gen 3 back up and will be available FP3 BGA packages since they are based on a new 28nm process blueprint. TDPs will range from 17W to 35W and the fries will be compatible with the AMD A77E "Bolton E4" PCH. AMD R-Series Bald Eagle APU

AMD R-Series "Merlin Falcon" SOC

The Merlin Falcon SOC will be based off AMD'southward side by side generation Excavator core architecture and will feature up to four x86 Excavator cores with 4 MB shared L2 cache. This series will target the loftier performance SOC segment and can be idea of as the embedded version of AMD's upcoming "Carrizo" APU. Nosotros have official confirmation for the first fourth dimension that the new Excavator CPU core and the Carrizo APU will be built on the 28nm procedure and not 20nm equally was initially thought.

Merlin Falcon SOC will feature 2nd generation HSA back up along with Dual channel 64-fleck DDR3 channel (ECC). The higher performance SOC will feature the PCH on the same die that will let PCI-e Gen 3 and Gen two along with SATA, USB 3.0/ 2.0, SPI, LPC back up. The side by side generation graphics chip will let for DirectX 11.1 graphics and a UVD 6 decoder. Some of the key features of Merlin Falcon SOC are highlighted beneath:

Adjacent Generation HD 10000 (Pirate Islands) Graphics compages.
4 Excavator CPU cores with 4mb of shared L2 cache.
2nd generation HSA.
ARM security processor. Similar to the ane featured in AMD's latest Beema/Mullins APUs.
Dual aqueduct DDR3 retentivity controller.
UVD (Universal Video Decode) 6 and VCE (Video Compression Engine) 3.

AMD R-Series "Heirofalcon" SOC

Another product in AMD'southward Embedded high-performance lineup is the first 64-fleck ARM based Hierofalcon SOC powered by upto eight ARM Cortex-A57 cores clocked at 2.0 GHz, iv MB of L2 cache and built on the 28nm process technology. The chip volition ship in the SP1 BGA package and features some new cache coherency feature such as total cache coherency, 8 MB L3 cache and SMMU (I/O address, mapping and protection). The scrap allows dual channel 64-scrap DDR3/DDR4 memory channels (ECC) with speeds of up to 1866 MHz. There'due south as well a crypto co-processor on board which might help mining cryptocurrency much more than efficient.

The SOC ranges between a TDP of 15 – 30 Due west. The highly integrated SoC includes 10 Gb KR Ethernet and PCI-Express Gen three for high-speed network connectivity, making it ideal for control airplane applications. The "Hierofalcon" serial likewise provides enhanced security with back up for ARM TrustZone technology and a defended cryptographic security co-processor, adjustment to the increased need for networked, secure systems. "Hierofalcon" is expected to be sampling in the 2nd quarter of 2022 with production in the second half of the year. AMD R-Series Hierofalcon SOC

AMD Embedded G-Series Family:

Next up, we take the AMD Embedded One thousand-Serial family which further consists of a few products. There are two solutions, the G-Serial "A" family is the low ability x86 based APUs/SOCs line while the K-Series "X" family is the low-ability ARM based APUs/SOCs line. The line consists of the EKabini SOC, Steppe Eagle SOC, Pergrine Falcon SOC and EOntario APU.

AMD G-Series "EOntario" APU

The AMD G-Series "Eontario" APU is based on a 40nm Bobcat cadre architecture featuring one-two x86 CPU cores that feature 512 KB of L2 enshroud and a 64-bit FPU. The chip makes employ of a VLIW based SIMDs engine that has DirectX xi support along with AMD APP (Accelerated Parallel Processing) technology, 3rd Generation UVD, DDR3-800/1333 MHz support and comes in the BGA package.

In that location isn't much going on with the I/O and display capabilities which have gotten rather sometime such as VGA, 8 PCI-east Gen 2 lanes, two display interfaces which can be either of HDMI, DVI or Display port standard. Supported by the A50M and A55E PCH, the Bobcat core powered Eontario APU comes in 4W to 18W chips.

AMD Chiliad-Serial "EKabini" SOC

The EKabini SOC is as unproblematic as it sounds, y'all may telephone call it an enhanced and embedded variant of the Kabini APU which features the 28nm Jaguar cadre architecture. Available in dual and quad core models, the fleck boasts 2mb L2 cache, and integrated PCH and is supported on the FT3 BGA bundle. Featuring back up for single channel DDR3 memory and a maximum of 2 UDIMMs/Then-DIMMs rated at DDR3-1600 (ane.35/1.25V). AMD says that their fleck will characteristic a next generation graphics core which is actually their existing GCN core that supports DirectX xi.ane.

The chip will be bachelor in a few scalable packages with an updated I/O controller that includes four x1 link PCI-e Gen two, one x4 PCI-due east Gen ii for discrete GPUs, 8 USB 2.0, 2 USB 3.0, 2 SATA III, SD card reader v3.0 and SDIO controller. AMD G-Series EKabini SOC

AMD G-Serial "Steppe Hawkeye" SOC

"Steppe Hawkeye" will farther extend the performance and depression-power range of the current laurels-winning AMD Embedded G-Serial APU SoC platform with an enhanced "Jaguar+" CPU core architecture and AMD Graphics Cadre Next GPU architecture that include new features for increased CPU and GPU frequency. The updated design will feature a unified northbridge with full HSA support and configurable variants of TDPs with less than 5W and up to 25W.

Designed for depression-ability embedded applications, "Steppe Hawkeye" is designed to offer increased operation-per-watt both at a lower TDP than the current AMD Embedded G-Serial APU SoC, besides as extending the loftier-terminate performance above 2 GHz. "Steppe Hawkeye" also provides embedded design engineers the flexibility to leverage the current AMD Embedded M-Serial APU SoC board design and software stack for a variety of applications with footprint compatibility. "Steppe Eagle" is expected to be bachelor in the first half of 2022.

AMD G-Serial "Lanner Falcon" and "Peregrine Falcon" SOC

The serial volition target the depression power segment. And will succeed the Beema/Mullins APUs. AMD will introduce its first ARM based APU solution ever side by side yr. Code named "Lanner Falcon" these APUs are role of the "SkyBridge" initiative which allows AMD to build pin compatible x86 and ARM based fries. The Lanner Falcon and Peregrine Falcon family of parts can be thought of as sister x86 and ARM APUs that will offer identical functionality only in two unlike instruction set flavors.

The ARM based Lanner Falcon will feature the new 20nm Cortex-A57 cores in quad core variants along with support for AMD's eight generation GCN based HD 10000 series graphics family. The x86 based Peregrine Falcon SOC will be based on the new Catamount architecture in dual and quad core flavors. Both chips will add together HSA two.0 functionality with OpenGL ES, OpenCL, DirectX eleven and EGL support. The multimedia features volition be upgraded with 4K 10 2K H.265, multi-format encode and decode. Peregrine Falcon SOC volition support DDR4 ram and would be based on the 20nm PUMA+ core architecture. These slides are a chip old and won't mention the details nosotros take gotten to know since AMD detailed their Skybridge initiative few months.

20nm Manufacturing process.
4 x86 or ARM cores (Puma or A57) with 2mb of shared L2 cache.
CPU frequency boost capable.
Dual channel DDR3/DDR4/LPDDR3 memory support or single channel with ECC. This is upwards from unmarried channel on the previous generation
Back up for HSA 2.0
8th generation (HD 10000/Pirate Islands) graphics cores.
4K x 2K H.265 encode and decode.

Next Generation Discrete Graphics

AMD'due south leaked roadmap didn't offer well-nigh as much detail on the graphics side every bit it did on the APU side. This is down to the highly competitive nature of the graphics front which forces AMD to exist more secretive on that front. However we did get a very valuable tidbit of data, a timeline for the launch of adjacent generation discrete graphics products.

If you look at AMD'southward Radeon graphics roadmap you'll notice that guidance is completely missing after tardily 2022. That's considering this roadmap was originally revealed to investors in November of 2022. Nosotros've only now gotten our hands on it. But at that place'southward a clear pattern. When a graphics product is released for the client segment information technology's followed past an embedded version approximately two months down line.

We can extrapolate from that the estimate timeframe for AMD's upcoming graphics products for the customer segment based on the E10xxx series. This puts the timeframe for AMD's new cards between lat Q4 of this twelvemonth and early Q1 of 2022. Earlier then AMD will have to make do with game bundles and price cuts to compete with Nvidia's GTX 900 serial. AMD is besides poised to make an proclamation on September 25th and then stay tuned for more info.